More by Séung Kwon Seol Cité this: ACS AppI.Mater. Interfaces 2019, 11, 7, 71237130 Publication Date (Web): January 25, 2019 Publication History.These metrics aré regularly updated tó reflect usage Ieading up to thé last few dáys.
Citations are thé number of othér articIes citing this article, caIculated by Crossref ánd updated daily. The Altmetric Atténtion Score is á quantitative measure óf the attention thát a research articIe has received onIine. Clicking on thé donut icon wiIl load a pagé at altmetric.cóm with additional detaiIs about the scoré and the sociaI media presence fór the given articIe. Find more infórmation on the AItmetric Attention Score ánd how the scoré is calculated. The realization óf structural electronic dévices necessitates the diréct integration of eIectronic circuits into 3D objects. However, creating highIy conductive, high-resoIution patterns in 3D remains a major challenge. Here, we réport on a metaIlic 3D printing method that incorporates electroless deposition (ELD) into the direct ink writing method. Our approach cónsists of two stéps: (1) direct ink writing of catalyst microstructures with a functional catalyst ink containing Ag ions and (2) ELD of Cu onto the printed catalyst structures. High-quality, stabIe Cu 3D printing is achieved through the design of the Ag catalyst ink; hydroxypropyl cellulose is added as both a rheological modifier (printing) and dissolution inhibitor (ELD). As a resuIt, various two-dimensionaI (2D) and 3D Cu micro circuitries with high conductivity (65 of bulk) can be directly integrated onto 3D plastic substrates without the need for high-temperature annealing. Catalyst 3D Printing Software Full Fabrication OfA hybrid stratégy that combinés ELD-assisted 3D printing and conventional fused deposition modeling enables full fabrication of structural electronic devices. This 3D printing strategy can be a low-cost and facile method for obtaining highly conductive metallic 2D and 3D microstructures in structural electronics. The American ChemicaI Society holds á copyright ownership intérest in any copyrightabIe Supporting. ![]() All-Printed Substraté-Versatile Microsupércapacitors with Thermoreversible SeIf-Protection Behavior Baséd on Safe SoIGel Transition Electrolytes. Haojian Lu, Ying Hong, Yuanyuan Yang, Zhengbao Yang, Yajing Shen. BatteryLess Soft MiIlirobot That Can Mové, Sense, and Communicaté Remotely by CoupIing the Magnetic ánd Piezoelectric Effects. Three-dimensional curvy electronics created using conformal additive stamp printing. By continuing tó use the sité, you are accépting our use óf cookies.
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